As the general agent fo✔✘✘♥r NEXENSOR and MSG iγβ®♣n China, Eurome will partiφλ'Ωcipate in the CSEAC China with∑≈♦ the two companies at the¶<  Wuxi International ♣∏≥↑Expo Center from September 25th to 27thααπ‌, 2024.

CSEAC， It is the abbrev≤π iation of China Semiconduct™↕×≤or Equipment Annual Conference and Se£↔✘→miconductor Equipment and ♣δφ✘Core Component Exhibition. Since it₽↕♠s establishment, it ha₹>s taken it as its respon₹>≠sibility to promote the develπ"™opment of China´s sem±↕βiconductor industry and iφ's committed to building a p¥‍rofessional, efficient, andγ‍σ cutting-edge platform for commun&←ication, exhibition, ↔‌♦and cooperation for the industry¶♥☆.
As an authoritative event in the≠€φ semiconductor industry, CSEAC br→‍<and represents high standards, speciali✔ &÷zation, and internationalization. ≤™Every annual confereδ¥nce brings together top domestic and in₽‍ternational research institutions☆±¶ and industry experts in semi✘©₩conductor manufacturing, pac​₩kaging and testing, equipment and '≤πcore components, mate¶↕♥×rial suppliers, etc., to jointly ex≈β™₹plore the latest technologies, marke™☆t trends, and development opportuniti∞λes in the semiconductor indu™£€stry.

Our booth number is C1-77.

The CEO of Nexensor will give a keyno₽•​te speech at this exhibition¥$ (Topic 1: 2024 Forum on New D♣♥£↑evelopments in Semicond♥<uctor Equipment and Core Compon§÷Ω≠ent Matching), introducing the₩≤φπ latest 3D optical inspecti"☆on technology and solut∞✔ions for advanced packaging. The time ☆σ₩will be from 16:10 to ∏±16:30 on September 25th.

At this exhibition, we will₩‌¶≥ showcase the latest testing techn∑↕ology applied by South Korean compσφ÷βany Neeson in the semicondu★±×©ctor and display screen industri©♦es:

1. Provide a comprehensiveα¥ 3D optical measurement solution for t↑™he advanced semiconductor packaging i">≥ndustry.

2. White light interΩ™ ferometric scanning sensor - with a¥↔ measurement speed of only 1 second↔♦$ and a Z-axis repeatabili‌ •ty accuracy of 10nm, it can be i©Ω¥ntegrated into the device for batch  β←detection.

3. Interferometric thickne₹ ×∏ss/displacement sensor - using nea✘ φ♣r-infrared interferometry, a♥​$$ single probe can measure thickness/®φΩdisplacement, suitable for application★↓≤$s such as wafer thickness measureme£δ¥nt.

We look forward to many new and oδ✔ld customers and friends visiting $$♦our booth to guide and discuss coop↕☆₹eration!

Exhibited products:

3D optical metrology solution &n® ≠Ωbsp;    &≥☆ nbsp;    &nbs∏÷p;   &nbs≠‌p;      &×™Ωnbsp;     &✔§£nbsp;   &™δ→βnbsp;    §♥σ  3D scanning WLI
   

Thickness and displacement₩↑•₩ sensor   →×

In addition, our company will a±ε lso showcase the German MSG♥$"$ autofocus sensor. The G☆≤erman MSG autofocus sensor is applied∞☆≈≠ in defect detection o®€f panels, glass and other pro¥≠ducts, suitable for TFT-LCD, OLED, Mi←‍cro/MiniLED and othe>‌r products.
   

Welcome to our booth≤​<∏ to have a look at our so↓≥$↕lution and talk about cooperation ←÷¥€issue!

If you are interested in nexensor a←≠nd MSG related products and sα☆"δolutions, please contact:

Martin@euro-me.com Tel: 0755-83§¶842035 MP：13632890602