Euro-me collaborates wi≥≥★>th NEXENSOR & MSG to particφ" ★ipate in the 2025 CIOE
Source : Euro-me Shenzhen Trade & D♣÷evelopment Co., Ltd. &®£★nbsp; Time : 2025-09-05&n→♦≠★bsp; H↔βits : 76
2025 marks the 30th anniverβsary of the establishment of Eu≠§✘¥o-me Company.As the general agent of₹★¥ NEXENSOR and MSG in the China regio✔₽≤n, Euro-me will participa∏☆te together with the two companies in ×∏₽CIOE2025 held at the Shenzh↑←₩en International Expo Center from Septe ®mber 10-12, 2025.
The 26th China International Opt<¶oelectronics Expo (CIOγ©♦φE) will be held from September Ω✔10-12, 2025 at the Shenzhen Internat✔™ional Convention and Exhib§>∑≠ition Center. As a comprehensive exhib↓ition covering the entire optoelectroni©↑≈♣c industry chain, CIOE China Optoel §ectronics Expo brings togeth•×er over 3800 high-quality exσ¥↑εhibitors from more than 30 countrie'®s and regions around the world. The eλ∑↓ight themed exhibitions cover σ÷information communica>γtion, precision optics, camera technolo✘'≤gy and applications, laser and intell↕™≠↕igent manufacturing, infrared, ↔←↔≠ultraviolet, intelligent sensing, new✘♦δ" displays AR & VR、 ↓↕The Optoelectronic Innovation and othe㮥r sectors are a one-stop effΩπγαicient procurement platfo¥±γrm for finding materials, components, e♥σquipment, and solutions needed in res§♥ earch and development and mδ anufacturing. They are also aφΩ π precise business mat₹€ ching platform for meeting business π☆λ∑needs, rapidly expanding b∞&©usiness social circleσσs, and grasping the forefrδ✘♣ont information and dynam↓$ics of industry deve± ≥£lopment.
Our booth number is 3A20-1.
At this exhibition, we will showcas♦>π e the latest testing te"→ chnology applied by Sou↕∏<th Korean company Naishen i∏↓≈n the semiconductor and dis∏•≈☆play industry
1. High speed line sca& nning white light triangulation s≠σensor for detecting BGA and BUMP.
2. Provide a comprehensive 3D ∑ optical measurement solution for the >÷☆advanced semiconductor pac₩φkaging industry.
3. White light interferometric scan'₩φ₽ning sensor - measurement speed only takes 1 second, Z-direction re→&≤Ωpeatability accuracy of 10nm ∏, can be integrated into equipment for '≠batch detection.
4. Interference based thicknes∑←↕δs/displacement sensor - u₽♥×✘sing near-infrared interferometr★ ♣y, a single probe can meas♣<<♠ure thickness/displac§ 'ement, suitable for applicatσ★≥ions such as wafer thickness measuremδ↕ent.
We look forward to many new and old↓∏∞ customers and friends visit≠λ↕ing our booth, providing guidance, δ≥≤and exploring cooperationε≈α!
Exhibiting products:
3D Free form Measure ♦¥→♦System &nbsγ×p; &nb€£±₩sp; 3D Sc↔₩∑anning Interferometer MicΩroscope
&₩ ♦nbsp; &nb∏λsp;
Interference based thickness/displa£ ♠cement sensor &♦∞nbsp; '£Ω$ white light triangulation sensor
 ∏☆≈; &Ω €nbsp; &δλnbsp;  φ Ω;
In addition, our company →♣will also exhibit the German MSG autofoγ•¥cus sensor. The Germ↔™<an MSG autofocus sens↕αor is applied in defect detec≤"→™tion of panels, glass, and other maδ×terials, suitable for vari¶♦ous products such as TFT-LCD<Ω↑, OLED, Micro/MiniLED, etc.
Welcome new and old friends ☆πto visit and negotiate at our boε↓₩oth!
If you are interested in Nexen♠λ©sor and MSG related ↑♦γproducts and solutio✔₩ns, please contact:
Martin@euro-me.com Tel:0 ∑δ'755-83842035 13632890602